Winbond Electronics has been approached by the Singapore government to set up a manufacturing site locally, and the Taiwan-based maker of specialty DRAM and flash memory is considering the invite, according to a report from Taiwan’s TechNews.
Taiwan led all regions/countries in wafer capacity with 21.3% share, a slight decrease from 21.7% in 2015 when the country first became the global wafer capacity leader, according to IC Insights.
It is unlikely to see 450mm (18-inch) wafer fabrication technology become mature over the next three years, according to Applied Materials CEO Gary Dickerson. The chipmaking industry’s transition to larger, 450mm-sized wafers remains years away.
Transition to 18-inch wafers remains years away, says Applied from Digitimes.
Taiwan Semiconductor Manufacturing Company (TSMC) is on track to start risk production of 5nm chips in the first half of 2019, said company co-CEO Mark Liu at its annual supply chain management forum on February 23.
TSMC on track to move 5nm to risk production in 1H19 from Digitimes.
Seasonality will drag down specialty IC foundry Vanguard International Semiconductor’s (VIS) revenues in the first quarter of 2017, which are forecast to decrease 1-5% sequentially.
VIS expects to post up to 5% revenue decrease in 1Q17 from Digitimes.
United Microelectronics (UMC) has announced the availability of mass production for ICs built using the foundry’s most-advanced 14nm FinFET technology.
UMC enters mass production for 14nm chips from Digitimes.
Asustek Computer is expected to unveil a new 2-in-1 notebook model, the ZenFlip UX370, at the upcoming Mobile World Congress (MWC) 2017, according to a Chinese-language Economic Daily News (EDN) report.
Asustek likely to unveil new 2-in-1 model at MWC 2017 from Digitimes.
Samsung Electronics has announced the launch of its latest premium application processor (AP), the Exynos 9 Series 8895. This is Samsung’s first processor chipset built using 10nm FinFET process technology with improved 3D transistor structure, which allows up to 27% higher performance while consuming 40% less power when compared to 14nm technology, the company claimed.
Samsung launches 10nm Exynos 9-series processor from Digitimes.
IC design house Elan Microelectronics, which specializes in touchscreen controller chips, expects its first-quarter 2017 revenues to decrease 6-9% sequentially, due to a seasonal slowdown in demand for consumer electronics devices as well as fewer working days during the Lunar New Year period.
Elan expects to post 6-9% decrease in 1Q17 revenues from Digitimes.
North America-based manufacturers of semiconductor equipment posted US$1.86 billion in billings worldwide in January 2017 (three-month average basis), according to SEMI.
Globalfoundries has announced the availability of its 45nm RF SOI (45RFSOI) technology offering, making it the first foundry to announce an advanced, 300mm RF silicon solution to support next generation millimeter-wave (mmWave) beam forming applications in future 5G base stations and smartphones.
United Microelectronics’ (UMC) board of directors has decided to deal out dividends of NT$0.50 (US$0.02) in cash for 2016, when the company generated net profits of NT$8.32 billion or NT$0.68 per share.
UMC to pay NT$0.50 cash dividend for 2016 from Digitimes.
Hong Kong University of Science and Technology (HKUST) has developed a high-voltage monolithic cascode diode combination (Figure 1) of silicon (Si) pn diode and normally-on aluminium gallium nitride (AlGaN) barrier metal-insulator-semiconductor high-electron-mobility transistor (MIS-HEMT)…
Silicon and III-nitride high-voltage monolithic cascode diode from Semiconductor Today Features.
Battery technology inspires a flexible, organic nonvolatile device for neuromorphic circuits that needs only millivolts to change statePhoto: Stanford University
A team based at Stanford University and at Sandia National Laboratories, in Livermore, Calif., have created a new form of “artificial synapse” that may one day be used to create flexible circuitry that could directly interface with the brain.
The new device, a form of organic transistor that the team calls an electrochemical neuromorphic organic device (ENODe), joins the ranks of technologies such as the memristor and phase-change memory: devices that may one day be used to create chips that can perform brain-like computations using far less power than even the most state-of-the-art silicon systems consume.
Illustration: Stanford UniversityThe new device contains two layers of the polymer separated by an electrolyte that permits ions but not electrons to cross. A voltage pulse applied to the “presynaptic” layer (top) alters the level of oxidation in the postsynaptic […]
A Low-Power Artificial Synapse Could One Day Interface with the Brain from IEEE Spectrum.
LED epitaxial wafer and chip maker Epistar has landed orders for VCSELs (vertical-cavity surface-emitting lasers) for use in proximity sensors for smartphones and will begin production in the third quarter of 2017, according to the company.
Epistar to produce VCSELs from Digitimes.
3S Silicon Tech started trading on Taiwan’s emerging stock market on February 21 at an initial price of NT$20 (US$0.65) per share, according to the semiconductor equipment company targeting the backend sector.
3S Silicon Tech debuts on Taiwan emerging stock market from Digitimes.
Noel Technologies, a specialty semiconductor foundry based in Silicon Valley, has expanded its wafer-fabrication facility by adding square footage and installing additional equipment that boost its production capacity by 25%, according to the company.
Navitas Semiconductor Inc of El Segundo, CA, USA has launched what it claims is the first integrated half-bridge gallium nitride (GaN) power IC. Half-bridge circuits are essential building blocks in power electronics, used in everything from smartphone chargers and laptop adapters to TVs, solar panels, data centers and electric vehicles…
Navitas launches first integrated half-bridge GaN power IC from Semiconductor Today.
The production value of Taiwan’s IC industry, consisting of designers, manufacturers, packaging and testing houses, will increase 5.8% in 2017 reaching NT$2,591.6 billion (US$84.1 billion), according to forecast made by the Taiwan Semiconductor Industry Association (TSIA) and Industrial Economics and Knowledge Center (IEK) under the government-sponsored Industrial Technology Research Institute.
Semiconductor-grade silicon wafer prices on a per-square inch basis, which reached an 11-year low of US$0.67, are set to rise in 2017 thanks to the already low point last year and a ramp-up of demand coming mainly from China-based foundries, according to Doris Hsu, chairman and CEO for GlobalWafers.
Silicon wafer prices to rise in 2017, says GlobalWafers from Digitimes.
University of Notre Dame and Cornell University in the USA have claimed the first measurements on aluminium nitride/gallium nitride (AlN/GaN/AlN) quantum well (QW) field-effect transistors (FETs) on bulk AlN substrates with re-grown ohmic contacts…
Bulk aluminium nitride platform for gallium nitride high voltage and power from Semiconductor Today Features.
Taiwan’s IC industry, consisting of designers, manufacturers, packaging and testing houses, generated production value of NT$2,449.3 billion (US$79.5 billion) in 2016, increasing 8.2% on year, according to data compiled by the Taiwan Semiconductor Industry Association (TSIA) and Industrial Economics and Knowledge Center (IEK) under the government-sponsored Industrial Technology Research Institute.
Taiwan IC production value rises 8.2% in 2016, say TSIA and IEK from Digitimes.
Asustek Computer is adjusting its tablet operations by decreasing the number of models developed, focusing shipments on fewer overseas markets, and transferring a portion of its about 1,000 employees specifically working on tablets to its VR (virtual reality) and AR (augmented reality), and smartphone business units, according to company CEO Jerry Shen.
Asustek adjusting tablet operations from Digitimes.
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has recently disclosed six separate purchases of manufacturing equipment and facilities for a total of NT$7.525 billion (US$244.4 million).
TSMC spends NT$7.5 billion on equipment from Digitimes.
Semiconductor equipment maker Foxsemicon Integrated Technology, an affiliate of the Foxconn Group, is expected to see its EPS top NT$8.50 (US$0.28) in 2016 and achieve an annual historic high, market watchers were quoted as saying in a recent report by Taiwan’s Central News Agency (CNA).
Equipment maker Foxsemicon to post record EPS for 2016 from Digitimes.
Eight-inch wafer fabs in China and Taiwan are running at full capacity driven by brisk demand for smartphone-use ICs including fingerprint-recognition sensors, LCD driver ICs and power management chips, according to industry sources.
Eight-inch fabs operating at full capacity from Digitimes.
Taiwan-based Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors, swung to net losses of NT$636 million (US$20.6 million) in 2016 from profits of NT$146 million a year ago. EPS for the year turned to negative NT$2.36.
Xintec swings to loss for 2016 from Digitimes.
Semiconductor equipment provider Applied Materials delivered another strong quarter for its display business, with its first quarter display revenues increasing 66% on year to US$422 million and its orders tripling to US$632 million. The company noted that since 2012 it has grown its display revenues by around 20% a year, and Applied believes it will book US$2 billion in orders for 2017.
One year after announcing mass shipments of liquid crystal on silicon (LCOS) microdisplays and wafer-level optics (WLO) products for augmented reality (AR) applications, Himax Technologies is now experiencing growing pains in this dynamic new market.
Himax remains committed to AR from Digitimes.
China-based IC foundries, such as Shanghai Huali Microelectronics (HLMC), are evaluating plans to offer FD-SOI process technology since they are less competitive in the mainstream FinFET segment led by the world’s major pure-play foundries and IDMs including Intel, Samsung and TSMC, according to industry sources.
China foundries planning FD-SOI process technology from Digitimes.