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Greatek building high-end packaging capacity

From Digitimes reposted by Silicon Valley Microelectronics

Logic IC packaging firm Greatek Electronics will start production for bumping and wafer-level CSP in July 2017 which will further buoy its sales performance for the year, according to industry sources.

Greatek building high-end packaging capacity from Digitimes.

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March 28th, 2017|General News Feed|

SMIC exploring opportunities in IoT boom

From Digitimes reposted by Silicon Valley Microelectronics

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) is engaged in growing its presence in the Internet of Things (IoT) field, with its enhanced mature technology portfolio, according to company senior VP Minhua Chi.

SMIC exploring opportunities in IoT boom from Digitimes.

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March 28th, 2017|General News Feed|

Transphorm announces first automotive-qualified GaN FETs

From Semiconductor Today reposted by Silicon Valley Microelectronics

Transphorm Inc of Goleta, near Santa Barbara, CA, USA, which designs and manufactures what it claims are the industry’s only JEDEC-qualified 650V gallium nitride (GaN) field-effect transistors (FETs) for high-voltage power conversion applications, says that its second-generation JEDEC-qualified high-voltage gallium nitride (GaN) technology is now the industry’s first GaN solution to earn automotive qualification, having passed the Automotive Electronics Council’s AEC-Q101 stress tests for automotive-grade discrete semiconductors…

Transphorm announces first automotive-qualified GaN FETs from Semiconductor Today.

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March 28th, 2017|General News Feed|

China LED chip makers expanding capacities

From Digitimes reposted by Silicon Valley Microelectronics

Sanan Optoelectronics, the largest China-based LED epitaxial wafer and chip maker, is expanding production capacity through adding 94 MOCVD sets to a total of 380 at the end of 2017, while fellow maker Huaian Aucksun Optoelectronics Technology will start operations at its new factory with monthly production capacity of 600,000 LED epitaxial wafers in the second quarter of 2017 and increase total monthly capacity to 7.5-8 million wafers at the end of the year, according to industry sources.

China LED chip makers expanding capacities from Digitimes.

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March 28th, 2017|General News Feed|

ALi, Alticast team up for pay TV

From Digitimes reposted by Silicon Valley Microelectronics

ALi, a Taiwan-based developer of set-top box chipsets, and Korea-based Alticast, which provides software used by the global pay-TV industry, have announced they will work together to explore business opportunities in the growing pay TV market.

ALi, Alticast team up for pay TV from Digitimes.

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March 27th, 2017|General News Feed|

Cypress to raise flash prices on tight supply, say reports

From Digitimes reposted by Silicon Valley Microelectronics

Cypress Semiconductor is set to adjust upward its prices for certain flash products on tight supply, according to reports from Taiwan’s TechNews and Economic Daily News (EDN).

Cypress to raise flash prices on tight supply, say reports from Digitimes.

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March 27th, 2017|General News Feed|

Robust GPP diode shipments to boost Lite-On Semi revenues

From Digitimes reposted by Silicon Valley Microelectronics

Lite-On Semiconductor, a maker of discrete and analog IC components, has landed GPP (glass passivated package) diode orders from China-based smartphone vendors such as Oppo and Vivo, according to industry sources. The Taiwan-based company is also looking to obtain new orders of GPP diodes from another China-based smartphone company and a US vendor later in 2017, said the sources.

Robust GPP diode shipments to boost Lite-On Semi revenues from Digitimes.

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March 27th, 2017|General News Feed|

Topco posts record profits in 2016

From Digitimes reposted by Silicon Valley Microelectronics

Wafer and IC distributor Topco Scientific has reported net profits of NT$1.203 billion (US$39.71 million) on revenues of NT$22.629 billion in 2016. Both figures were the company’s highest annual levels.

Topco posts record profits in 2016 from Digitimes.

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March 27th, 2017|General News Feed|

Asustek plans to spin off AR development team, says paper

From Digitimes reposted by Silicon Valley Microelectronics

Asustek Computer plans to spin off its AR/VR development team to become an independent startup, according to a Chinese-language Commercial Times report.

Asustek plans to spin off AR development team, says paper from Digitimes.

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March 27th, 2017|General News Feed|

TSMC to begin volume production of A11 chips in April, says paper

From Digitimes reposted by Silicon Valley Microelectronics

Taiwan Semiconductor Manufacturing Company (TSMC) will begin volume production of Apple’s A11 chips in April and will prepare a capacity for production of 50 million units of the chip before July, according to a Chinese-language Economic Daily News (EDN) report.

TSMC to begin volume production of A11 chips in April, says paper from Digitimes.

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March 27th, 2017|General News Feed|

GaN RF power devices to represent nearly 25% of high-power semiconductors for mobile wireless infrastructure in 2017

From Semiconductor Today reposted by Silicon Valley Microelectronics

Despite a lackluster 2016 gallium nitride (GaN) RF power semiconductor devices gained meaningful market share over the last two years, and will represent nearly 25% of all high-power semiconductors for mobile wireless infrastructure in 2017, forecasts ABI Research. Future revenue growth will be driven by the Asia-Pacific region, including China…

GaN RF power devices to represent nearly 25% of high-power semiconductors for mobile wireless infrastructure in 2017 from Semiconductor Today.

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March 24th, 2017|General News Feed|

Semi-polar indium gallium nitride laser diode/waveguide photodiode combo

From Semiconductor Today Features reposted by Silicon Valley Microelectronics

Researchers based in Saudi Arabia and USA have integrated a waveguide photodetector (WPD) with a 405nm laser diode (LD) using free-standing semi-polar gallium nitride (GaN) technology…

Semi-polar indium gallium nitride laser diode/waveguide photodiode combo from Semiconductor Today Features.

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March 24th, 2017|General News Feed|

TEEMA forms automotive alliance

From Digitimes reposted by Silicon Valley Microelectronics

The Taiwan Electrical and Electronic Manufacturers’ Association (TEEMA) has invited semiconductor, information technology and communications (ITC) and automobile and automotive component makers to form Taiwan Vehicle-Team (V-Team) specifically for boosting development of automotive electronics manufacturing in Taiwan, and helping Taiwan-based makers enter the supply chains of foreign automobile makers, according to TEEMA.

TEEMA forms automotive alliance from Digitimes.

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March 24th, 2017|General News Feed|

SPIL to pay NT$1.75 cash dividend for 2016

From Digitimes reposted by Silicon Valley Microelectronics

IC packager Siliconware Precision Industries (SPIL) has decided to distribute a cash dividend of NT$1.75 (US$0.06) for 2016, according to a resolution passed by the company’s board of directors.

SPIL to pay NT$1.75 cash dividend for 2016 from Digitimes.

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March 24th, 2017|General News Feed|

TSMC to start installing equipment at Nanjing fab in 2H17

From Digitimes reposted by Silicon Valley Microelectronics

Equipment move-in will take place at Taiwan Semiconductor Manufacturing Company’s (TSMC) Nanjing plant in the second half of 2017, according to Roger Luo, president for TSMC Nanjing. The new 12-inch facility is set to begin pilot production in the first half of 2018 followed by volume production in the second half of the year, said Luo.

TSMC to start installing equipment at Nanjing fab in 2H17 from Digitimes.

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March 24th, 2017|General News Feed|

Win Semi to deal out cash dividend of NT$4.50 for 2016

From Digitimes reposted by Silicon Valley Microelectronics

Win Semiconductors’ board of directors has adopted a proposal recommending the distribution of a NT$4.50 (US$0.15) cash dividend per share for 2016, when the company generated a record NT$6.04 in EPS.

Win Semi to deal out cash dividend of NT$4.50 for 2016 from Digitimes.

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March 24th, 2017|General News Feed|

Samsung, eSilicon tape out 14nm network processor with Rambus 28G SerDes solution

From Digitimes reposted by Silicon Valley Microelectronics

Samsung Electronics has announced a successful network processor tape-out based on Samsung’s 14LPP (Low-Power Plus) process technology in collaboration with eSilicon and Rambus. This achievement is built on Samsung’s cutting-edge foundry process and design infra for network applications, eSilicon’s complex ASIC and 2.5D design capability with its IP solutions, and Rambus’ high-speed 28G SerDes solution.

Samsung, eSilicon tape out 14nm network processor with Rambus 28G SerDes solution from Digitimes.

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March 23rd, 2017|General News Feed|

ASE says no plan to set up local site in US for packaging services

From Digitimes reposted by Silicon Valley Microelectronics

Advanced Semiconductor Engineering (ASE) has a site in the US for IC testing, and has no plans to expand the site or build another locally for packaging services, according to company COO Tien Wu.

ASE says no plan to set up local site in US for packaging services from Digitimes.

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March 23rd, 2017|General News Feed|

Transphorm introduces Silicon Valley Center of Excellence

From Semiconductor Today reposted by Silicon Valley Microelectronics

Transphorm Inc of Goleta, near Santa Barbara, CA, USA, which designs and manufactures what it claims are the industry’s only JEDEC-qualified 650V gallium nitride (GaN) field-effect transistors (FETs) for high-voltage power conversion applications, has formally introduced its Silicon Valley Center of Excellence…

Transphorm introduces Silicon Valley Center of Excellence from Semiconductor Today.

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March 23rd, 2017|General News Feed|

Qualcomm, ASE, Brazil government sign MOU to build IC testing/packaging plant in Brazil, says paper

From Digitimes reposted by Silicon Valley Microelectronics

Advanced Semiconductor Engineering (ASE), Qualcomm and the Brazil government reportedly have signed a MOU to jointly invest US$200 million initially to establish an IC testing/packaging plant in Sao Paulo, according to Chinese-language Commercial Times Report.

Qualcomm, ASE, Brazil government sign MOU to build IC testing/packaging plant in Brazil, says paper from Digitimes.

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March 23rd, 2017|General News Feed|

Pegatron said to have landed control computer orders for Tesla Model 3

From Digitimes reposted by Silicon Valley Microelectronics

Tesla is planning to increase orders to its upstream supply partners for its Model 3, and orders for the control computer reportedly have been landed by Pegatron Technology, according to sources from the upstream supply chain.

Pegatron said to have landed control computer orders for Tesla Model 3 from Digitimes.

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March 23rd, 2017|General News Feed|

Aixtron receives repeat order from Sumitomo for GaN-on-SiC production technology

From Semiconductor Today reposted by Silicon Valley Microelectronics

Deposition equipment maker Aixtron SE of Herzogenrath, Germany has delivered a CRIUS metal-organic chemical vapor deposition (MOCVD) system in 4”-wafer configuration to Japan’s Sumitomo Electric Device Innovations Inc (SEDI) in order to boost its production of gallium nitride on silicon carbide (GaN-on-SiC) devices for RF data transfer applications including for the upcoming 5G wireless mobile network. The system was put into operation in fourth-quarter 2016…

Aixtron receives repeat order from Sumitomo for GaN-on-SiC production technology from Semiconductor Today.

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March 22nd, 2017|General News Feed|

Gallium nitride vertical junction barrier Schottky diodes

From Semiconductor Today Features reposted by Silicon Valley Microelectronics

Cornell University, Qorvo Inc and IQE RF LLC in the USA have reported on work on vertical junction barrier Schottky diodes (JBSDs) produced on free-standing gallium nitride (GaN) [Wenshen Li, et al, IEEE Transactions on Electron Devices, published online 21 February 2017]. The aim was to combine the good characteristics of Schottky barrier diodes and pn diodes (PNDs) for power applications…

Gallium nitride vertical junction barrier Schottky diodes from Semiconductor Today Features.

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March 22nd, 2017|General News Feed|

GET unveils light-weight PV modules

From Digitimes reposted by Silicon Valley Microelectronics

Solar-grade polycrystalline silicon wafer and PV module maker Green Energy Technology (GET) has unveiled light-weight PV modules developed through cooperation with industrial design house Gixia Group, according to GET president Swean Lin.

GET unveils light-weight PV modules from Digitimes.

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March 22nd, 2017|General News Feed|

UMC Xiamen fab gearing up for 28nm chip production

From Digitimes reposted by Silicon Valley Microelectronics

United Microelectronics’ 12-inch foundry subsidiary in Xiamen, China will be ready for 28nm chip production in the second quarter of 2017 vying for orders from China’s local handset chip suppliers.

UMC Xiamen fab gearing up for 28nm chip production from Digitimes.

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March 22nd, 2017|General News Feed|

Coasia, Sunnic enjoy robust demand for CMOS image sensors

From Digitimes reposted by Silicon Valley Microelectronics

Robust CMOS image sensor demand will make a positive contribution to both Taiwan-based Coasia Microelectronics and Sunnic Technology & Merchandise, according to industry sources. Coasia distributes CMOS image sensors mainly for Samsung, while Sunnic sells Sony’s CMOS image sensor components.

Coasia, Sunnic enjoy robust demand for CMOS image sensors from Digitimes.

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March 21st, 2017|General News Feed|

Akash Systems formed to apply GaN-on-diamond technology to SatComs

From Semiconductor Today reposted by Silicon Valley Microelectronics

Felix Ejeckam and Ty Mitchell, both experts in gallium nitride (GaN)-on-diamond technology, have formed Akash Systems Inc of San Francisco, CA, USA, targeting fast, affordable satellite communications to address the challenge of worldwide data demand outpacing the frequency, bandwidth and power capabilities of existing communications infrastructure…

Akash Systems formed to apply GaN-on-diamond technology to SatComs from Semiconductor Today.

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March 21st, 2017|General News Feed|

TSEC to set up 3.5MWp rooftop PV system in northern Taiwan, says paper

From Digitimes reposted by Silicon Valley Microelectronics

Crystalline silicon solar cell maker TSEC has indicated that Forsun Energy, its subsidiary engaged in PV power generation EPC (engineering, procurement, construction) and operation, has won an open bid to set up a PV system with installation capacity of 3.5MWp on local government buildings in northern Taiwan, according to a Chinese-language Economic Daily News (EDN) report.

TSEC to set up 3.5MWp rooftop PV system in northern Taiwan, says paper from Digitimes.

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March 21st, 2017|General News Feed|

China semi equipment industry working hard to play catch-up

From Digitimes reposted by Silicon Valley Microelectronics

It is hard for China-based semiconductor equipment suppliers to catch up with their bigger international peers in terms of technology, according to Zhao Jinrong, CEO for Naura Technology (formerly Beijing Sevenstar Electronics).

China semi equipment industry working hard to play catch-up from Digitimes.

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March 21st, 2017|General News Feed|

Advantech to push Industry 4.0 in Thailand with local partners

From Digitimes reposted by Silicon Valley Microelectronics

Industrial PC (IPC) maker Advantech recently hosted a forum in Bangkok, Thailand focusing on Industry 4.0 and has signed a memorandum of cooperation with Thailand’s Federation of Thai Industries (FTI) and local leading ICT player Computer Union, looking to push into Thailand’s Industry 4.0 market.

Advantech to push Industry 4.0 in Thailand with local partners from Digitimes.

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March 21st, 2017|General News Feed|