Back grinding is a process that removes silicon from the back surface of a wafer. SVM provides grinding on our own substrates or on customer supplied wafers. We process bare and device patterned wafers with high yield and offer wafer thinning to customer specifications.
- Diameters: 25mm (1 inch) – 300mm (12 inch)
- Final wafer thickness for 50mm to 200mm: >=50 um
- Final Wafer Thickness for 300mm wafers only: >=80 um
- Back surface Finish: Ground, lapped, or polished
- Typical Yield: >=95%
Please CONTACT SVM for further information on Back Grinding or to discuss your current requirements.