SVM has strategic partnerships with the world’s largest silicon wafer manufacturing companies. Although 99% of wafer materials shipped are major manufacturer factory sealed, SVM does offer wafer polishing solutions.
The following polishing services are available:
- Wafer Diameters: 25mm (1 inch) – 300mm (12 inch)
- Single side polishing (SSP)
- Double side polishing through simultaneous or “flip” polishing techniques ( DSP)
- Backside polishing
- Kiss Polishing – Light polish which will remove minor surface scratches or defects
- Chemical Mechanical Planarization (CMP) of patterned wafer substrates and/or blanket films
- Typical Yield: >=95%
Wafer polishing is available on virgin or reclaim silicon wafer substrates. Please reference the WAFER RECLAIM section of this website for information on SVM’s Wafer Reclaim service solutions.
Please CONTACT SVM for further information on Wafer Polishing or to discuss your current requirements.