Back grinding is a process that removes silicon from the back surface of a wafer. Silicon Valley Microelectronics provides grinding on our own substrates or on customer supplied wafers. We process bare and device patterned wafers with high yield and offer wafer thinning to customer specifications.
SVM Wafer Back Grinding Capabilities:
- Diameters: 25mm (1 inch) – 300mm (12 inch)
- Final wafer thickness for 50mm to 200mm: >=50 um
- Final Wafer Thickness for 300mm wafers only: >=80 um
- Back surface Finish: Ground, lapped, or polished
- Typical Yield: >=95%
Please CONTACT SVM for further information, to place an order or to discuss your current requirements.