Back grinding is a process that removes silicon from the back surface of a wafer. Silicon Valley Microelectronics provides grinding on our own substrates or on customer supplied wafers. We process bare and device patterned wafers with high yield and offer wafer thinning to customer specifications.

SVM Wafer Back Grinding Capabilities:

  • Diameters: 25mm (1″) – 300mm (12″)
  • Final wafer thickness for 50μm to 200μm: ≥ 50μm
  • Final wafer thickness for 300mm wafers only: ≥ 80μm
  • Back surface finish: Ground, lapped, or polished
  • Typical yield: ≥ 95%


For more information on this process, to request a quote or to discuss your current requirements, please CONTACT SVM today, or visit our ONLINE INVENTORY.

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