Wafer dicing is the process of sawing a wafer into its respective parts, called die. Silicon Valley Microelectronics dices silicon and other various types of wafer substrates to any size required using precision diamond dicing blades.
Dicing services are available for all wafer diameters ranging from 50mm to 300mm, for both patterned and non-patterned wafer substrates. We specialize in processing very thin substrates with maximum yield.
SVM provides pick and place and a large selection of die packaging options including tape/ring, gel and waffle packs.
Please CONTACT SVM for further information on wafer dicing or to discuss your current requirements.