Silicon Valley Microelectronics provides wafer downsizing solutions on bare wafers or wafers with blanket films or patterns.

There are two common methods to downsize wafers: laser cut down and water-jet cut down. Because both processes are in an open air environment, SVM generally recommends a SEMI standard edge bevel to reduce the chance of edge chipping.

Laser cut down:

Wafer downsizing is accomplished by entering coordinates into a computer that guide laser cutting. The wafer is cut with either multiple holes or shapes, or the entire wafer is cut. Using a wafer’s notch or flat as a starting point allows the wafer to maintain the same orientation after cutting. If the application requires, it is possible to re-cut wafer orientation notches or flats. Laser cut down yields a diameter tolerance of 0.05mm. In order to protect against contaminants during the cutting process, a vacuum collects particles and dust as the laser moves through the wafer. In some applications, a layer of photoresist is placed on the surface of the wafer prior to cutting to further protect it from particles and other contaminants.

Synova Laser cut down:

The Synova laser microjet uses a 1064nm wavelength laser guided by a high-powered stream of deionized water to cut silicon. Because water cools as it guides the laser, there is minimal thermal thermal damage to the substrates. This makes this method particularly advantageous for thin wafers, patterned wafers and wafers with limited thermal capabilities. The wafer orientation notches can be added or re-cut during processing. A diameter tolerance of +/- 0.2mm is achievable in this process.


Please CONTACT SVM to speak with a knowledgeable member of our team for further information on wafer downsizing, to place an order or to discuss your current requirements.

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