Silicon Valley Microelectronics provides wafer downsizing solutions on bare wafers or those processed with blanket films or patterns.

The two most common methods to downsize a wafer are laser cut down and water-jet cut down. Both processes are performed in an open air environment after which SVM recommends a SEMI standard edge bevel to reduce the chance of edge chipping.

Laser Cut down:

Wafer downsizing is accomplished by entering coordinates into a computer that guide laser cutting. Multiple holes or shapes can be cut out of a wafer or the entire wafer can be downsized. Wafer orientation is maintained by using the notch or primary flat as a starting point. If required, it is possible to re-cut wafer orientation notches or flats. Laser cut down yields a diameter tolerance of 0.05mm.

Water-Jet Cut down:

The water-jet method uses a laser to guide a high-powered stream of water that cuts the silicon. Because the water cools the laser, there is no damage to the wafer caused by heat or melted silicon around the edge. Wafer orientation notches can be maintained or re-cut. Abrasives are often mixed with the water to facilitate the cutting process. A diameter tolerance of +/-0.2mm is achievable in this process.

Please CONTACT SVM to speak with a knowledgeable member of our team for further information on wafer downsizing, to place an order or to discuss your current requirements.

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