Silicon Valley Microelectronics provides wafer lapping services when there is a need to remove bulk amounts of silicon from a wafer substrate. Bulk silicon removal is often required in wafer reclaim and for wafer thinning projects.

SVM provides lapping for all wafer diameters 50mm to 300mm.

Please CONTACT SVM for further information on wafer lapping, to place an order or to discuss your current requirements.

Silicon Wafers Non-Silicon Wafers
Wafer Services Lithography and Custom Films