SVM Wafer Thinning:

There are four primary methods of wafer thinning:

  1. mechanical grinding
  2. chemical mechanical polishing (CMP)
  3. wet etching
  4. atmospheric downstream plasma (ADP) dry chemical etching (DCE).

Please see BACK GRINDING and LAPPING for more information.

Please CONTACT SVM to speak with a member of our knowledgeable team for further information on wafer thinning, to place an order or to discuss your current requirements.

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